The latest leak reveals the TDP requirements of AMD’s AM5 LGA 1718 socket’s for next-gen Ryzen CPU’s

The latest details regarding the AMD AM5 LGA 1718 socket featuring support for next-gen Ryzen Desktop CPUs and APUs have been leaked online. The latest leaks come from Lexington over at Twitter who leaked out the first design schematics of the AM5 socket.

There were many leaks regarding the AMD AM5 LGA 1718 socket platform but what’s new is the fact the AM5 will retain compatibility with AM4 heatsinks as well as coolers despite having such a massive change in the design.

Coming to the TDP requirements of the CPU, the AMD AM5 CPU platform will feature six different segments and the flagship has 170W CPU which is recommended for Liquid coolers (280mm or higher). It is followed by 120W TDP CPUs which the manufacturer recommends for a high-performance air-cooler. Coming down we have the 45-105W variants which are listed as SR1/SR2a/SR4 thermal segments meaning that these cards require standard heatsink solutions while running in a stock configuration.

The leaker also provided information stating that the AMD AM5 might have two different IO dies. However for now there is no information as to if these will be the platform-specific IO dies (PCH) or the Ryzen specific IO dies (IOD). There are rumours that the Zen3D will be featured in the next-gen Ryzen mainstream lineup and will also feature an IOD than the one on Raphael.

The leaked images reveal that the AMD Ryzen Raphael Desktop CPUs feature a perfect square shape (45x45mm) however they will be housing a very chunky integrated heat spreader or IHS. The reason given behind this is that they are dense and the reason is that they could be like that to balance out the thermal load across multiple chipsets.

new Zen 4 architecture is rumoured to deliver up to 25% IPC gain over Zen 3 and hit clock speeds of around 5 GHz.

‘Mark, Mike, and the teams have done a phenomenal job. We are as good as we are with the product today, but with our ambitious roadmaps, we are focusing on Zen 4 and Zen 5 to be extremely competitive.

‘There will be more core counts in the future – I would not say those are the limits! It will come as we scale the rest of the system.’

AMD CEO, Dr. Lisa Su via Anandtech

AMD’s Rick Bergman on Next-Gen Zen 4 Cores For Ryzen CPUs

Q- How much of the performance gains delivered by AMD’s Zen 4 CPUs, which are expected to use a 5nm TSMC process and might arrive in early 2022, will come from instructions per clock (IPC) gains as opposed to core count and clock speed increases.

Bergman: “[Given] the maturity of the x86 architecture now, the answer has to be, kind of, all of the above. If you looked at our technical document on Zen 3, it was this long list of things that we did to get that 19% [IPC gain]. Zen 4 is going to have a similarly long list of things, where you look at everything from the caches, to the branch prediction, [to] the number of gates in the execution pipeline. Everything is scrutinized to squeeze more performance out.”

“Certainly [manufacturing] process opens an additional door for us to [obtain] better performance-per-watt and so on, and we’ll take advantage of that as well.”

AMD Mainstream Desktop CPU Generations Comparison:

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