Apple and Qualcomm are seeking talent with expertise in Intel’s EMIB advanced packaging technology, signaling a potential shift in the semiconductor supply chain. As TSMC’s packaging capacity struggles to meet AI chip demand, Intel’s foundry services are emerging as a viable alternative.
Intel Advanced Packaging Technologies
| Technology | Type | Key Feature |
|---|---|---|
| EMIB | 2.5D | Connects chiplets with silicon bridge, no large interposer needed |
| Foveros | 3D | Stacks dies vertically using TSVs for enhanced density |
Intel’s EMIB technology eliminates the need for a large interposer, unlike TSMC’s CoWoS, making it a cost-effective solution. Meanwhile, Foveros is regarded as one of the most highly regarded 3D packaging solutions in the industry.
Why Companies Are Turning to Intel
TSMC’s AI chip production capacity is unable to keep up with rapidly growing demand, pushing order backlogs into 2026. This capacity crunch has created an opening for Intel’s foundry services. Since Intel’s Foveros is comparable to TSMC’s CoWoS-S, it has become a viable option to ensure supply.
Recent job postings reveal Apple hiring a DRAM packaging engineer requiring experience with EMIB, while Qualcomm seeks a Director familiar with Intel’s packaging technology. Even NVIDIA’s CEO Jensen Huang has praised Intel’s Foveros technology, demonstrating broad industry interest.
The strategic advantage extends beyond technology. Intel offers geographic diversity with facilities across the US, reducing supply chain risks compared to Taiwan-concentrated TSMC operations. With companies like Microsoft, Amazon, and Cisco also exploring Intel’s services, the foundry business could open a new revenue frontier for the chipmaker.
For more details on Intel’s packaging portfolio, visit Intel Foundry’s official packaging page.
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FAQs
What is Intel EMIB technology?
EMIB connects multiple chiplets using a small silicon bridge without requiring large interposers.
Why are companies considering Intel over TSMC?
TSMC’s packaging capacity shortages and order backlogs are driving interest in Intel’s alternative solutions.
