MediaTek’s next-gen Dimensity 2000 to be fabricated using TSMC’s 4nm process node

According to recent rumours flying around, the next generation of MediaTek Dimensity flagship chipsets will be based on the new ARMv9 architecture. The leak comes from recent claims that claim that MediaTek could be one of the first companies to place orders with TSMC‘s 4 nm foundries.

Some of the major specs of the upcoming chip from MediaTek which is dubbed the Density 2000 have just been revealed. According to sources, the Density 2000 will be featuring one Cortex-X2 prime core clocked at 3.0 GHz, three Cortex-A710 cores, and four A510 cores.

This is similar to the setup which can be found on Snapdragon 898 and the Exynos 2200 that will be based on Samsung‘s 4nm process. But, the South Korean tech giant is a step ahead and has recently tied with AMD to produce an RDNA2 based GPU. On the other hand, Huawei is surrounded by an ocean of fire and the company doesn’t seem to show immediate signs of recovery.

All this development means that the upcoming Dimensity 2000 will be the only chipset to use the new Mali-G710 M. The G710 will be the successor of G78 and is set to give a 20% boost in the speeds and 35% better performance for machine learning tasks.

Samsung on the other hand expects its new chips to be around 30% faster than the older Mali chips it used however, the actual performance of its SoCs will be dictated by the clock speeds on the two 4 nm nodes.

By the end of this year, we are going to see fierce competition between the chips from Samsung, Qualcomm, and MediaTek, and though there are plenty of early benchmarks that give a hint at how fast the upcoming chipsets are going to be that’s not something to go by. The first ARMv9 phones with the new chips could be out as early as next year.


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