MediaTek develops a new Filogic chipset to bring Wi-Fi 6 or 6E connectivity to next-gen smartphones

MediaTek is a market leader in the manufacture of electronic components and the company’s SoCs are the leader in mobile and portable device markets. But, now the company has just recently expanded its field to the new Filogic series for Wi-Fi 6 or 6E connectivity.

This new line has kicked off with the launch of its inaugural members. MediaTek’s 630 is a chipset design to offer compatibility with interfaces including the PCIe and is also rated for both Wi-Fi 6 and 6E.

The chip reportedly has a 5/6GHz system for the 3T3R (3×3) antenna type, involving the integrated front-end modules (FEMs) and, will make it capable of competing effectively with older, discrete-FEM 2T2R set-ups.

The manufacturer also states that the 630’s extra antenna support makes for “superior transmit beamforming”. The company also combines a reduced radio-frequency front-end (RFFE) surface area with this novel integration for a smaller footprint which offers a reduced bill of materials, allowing the mobile manufacturers to design a thinner, lighter, and potentially more cost-effective device.

MediaTek also asserts that the Filogic 630 can also be reportedly combined with the 830 for powerful tri-band (2×2 2.4GHz and 3×3 5 to 6GHz) Wi-Fi specs. This provides a new 12nm dedicated dual 4×4 Wi-Fi 6/6E SoC which is made using the quad ARM Cortex-A53 cores at up to 2GHz delivering up to 6Gb/s speeds.

This nascent Filogic series is Wi-Fi Alliance EasyMesh certified, and also features MediaTek’s FastPath technology which offers a reduced latency in tasks such as gaming or augmented/virtual reality (AR/VR) applications.

MediaTek also asserts that its new 630 chipsets can be used for a range of things including integration in the laptops, NAS products, or smart TVs of the near future, next-gen routers, smart speakers, broadband CPEs, security cameras, and even edge devices. 


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